16 Patents
- US125974622026Non-volatile Memory with Hybrid Routing for Shared Word Line Switches
Sandisk Technologies, Inc.
0 cites - US125819842026Apparatus and Methods for Bonding Pad Redistribution Layers in Integrated Circuits
Sandisk Technologies, Inc.
0 cites - 0 cites
- US123549552025Three-dimensional Memory Device with High Contact via Density and Methods of Forming the Same
Sandisk Technologies, Inc.
0 cites - US123474922025Three-dimensional Memory Device with High Contact via Density and Methods of Forming the Same
Sandisk Technologies, Inc.
0 cites - US122303352025Data Latch Programming Algorithm for Multi-bit-per-cell Memory Devices
SANDISK TECHNOLOGIES LLC
0 cites - US122074592025Three-dimensional Memory Array with Dual-level Peripheral Circuits and Methods for Forming the Same
SANDISK TECHNOLOGIES LLC
0 cites - US120043482024Three-dimensional Memory Array with Dual-level Peripheral Circuits and Methods for Forming the Same
SANDISK TECHNOLOGIES LLC
0 cites - 0 cites
- US119439222024Non-volatile Memory with Three Dimensional Stacked Word Line Switches
Western Digital Technologies, Inc.
0 cites - 0 cites
- US118171502023Non-volatile Memory with Different Word Line Hook Up Regions Based on Pass Through Signals
Sandisk Technologies LLC
0 cites - US117913272023Three-dimensional Memory Device Having Support-die-assisted Source Power Distribution and Method of Making Thereof
SANDISK TECHNOLOGIES LLC
0 cites - US117929882023Three-dimensional Memory Device with Separated Contact Regions and Methods for Forming the Same
SANDISK TECHNOLOGIES LLC
0 cites - US117587302023Bonded Assembly of a Memory Die and a Logic Die Including Laterally Shifted Bit-line Bonding Pads and Methods of Forming the Same
SANDISK TECHNOLOGIES LLC
0 cites - US117283052023Capacitor Structure Including Bonding Pads as Electrodes and Methods of Forming the Same
SANDISK TECHNOLOGIES LLC
0 cites