Fumiaki Ishikawa

3 Patents

• US126104632026

  Copper Base Substrate Comprising an Insulating Layer Having a Specific Relationship Between Thickness and Elastic Modulus

  MITSUBISHI MATERIALS CORPORATION

  0 cites
• US125422582026

  Member for Plasma Processing Apparatus, Method for Manufacturing Same, and Plasma Processing Apparatus

  MITSUBISHI MATERIALS CORPORATION

  0 cites
• US121273422024

  Metal Base Substrate, Electronic Component Mounting Substrate

  MITSUBISHI MATERIALS CORPORATION

  0 cites