Fui Yee Lim

3 Patents

• US124827192025

  Low-stress Thermal Interface

  NXP USA, Inc.

  0 cites
• US124461582025

  Circuit Modules with Encapsulant-embedded Leadframe Terminals, and Methods of Fabricating Such Circuit Modules

  NXP USA, Inc.

  0 cites
• US115812412023

  Circuit Modules with Front-side Interposer Terminals and Through-module Thermal Dissipation Structures

  NXP USA, Inc.

  0 cites