Fu-yuan Chen

3 Patents

• US123623162025

  Electronic Structure Having a Protrusion Structure Disposed in a Gap Between a Circuit Pattern Structure and a Packaging Structure

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US121836832024

  Electronic Package Structure

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US119618082024

  Electronic Package Structure with Reinforcement Element

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites