20 Patents
- US126159692026Phase-change Memory Device with Tapered Thermal Transfer Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US126046772026Semiconductor Device and Methods of Manufacturing
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US125987562026Phase Change Material (PCM) Switch Having Low Heater Resistance
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US125884292026Resistive Memory Device Including a Silicon Oxide Base Spacer and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US125076022025RRAM with Post-patterned Treated Memory Films to Provide Improved Endurance Characteristics and Methods for Forming
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US123695032025Encapsulated Phase Change Material Switch and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US123546952025Trench Formation Scheme for Programmable Metallization Cell to Prevent Metal Redeposit
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123027642025In-situ Formation of a Spacer Layer for Protecting Sidewalls of a Phase Change Memory Element and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - 0 cites
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- US122258292025Semiconductor Structure, Electrode Structure and Method of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - 0 cites
- US121610572024Method for Forming Semiconductor Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US119505232024Memory Device, Memory Integrated Circuit and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US118942672024Method for Fabricating Integrated Circuit Device
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US117858612023Semiconductor Structure and Method of Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US117857862023Trench Formation Scheme for Programmable Metallization Cell to Prevent Metal Redeposit
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US116372402023Semiconductor Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US115814842023Semiconductor Structure, Electrode Structure and Method of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
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