Freek Egbert Van Straten

6 Patents

• US125060842025

  Methods of Fabricating Substrates with Thermal Vias and Sinter-bonded Thermal Dissipation Structures

  NXP USA, Inc.

  0 cites
• US124827192025

  Low-stress Thermal Interface

  NXP USA, Inc.

  0 cites
• US120149712024

  Thermal Interface Structures, Electrical Systems with Thermal Interface Structures, and Methods of Manufacture Thereof

  NXP USA, Inc.

  0 cites
• US119293102024

  Radio Frequency Packages Containing Substrates with Coefficient of Thermal Expansion Matched Mount Pads and Associated Fabrication Methods

  NXP USA, Inc.

  0 cites
• US118429572023

  Amplifier Modules and Systems with Ground Terminals Adjacent to Power Amplifier Die

  NXP USA, Inc.

  0 cites
• US116212282023

  Substrate with Thermal Vias and Sinter-bonded Thermal Dissipation Structure

  NXP USA, Inc.

  0 cites