Patents/Inventors

Frederick Atadana

Hillsboro, ORUS3 patents

3 Patents

US126160262026
Permanent Layer for Bump Chip Attach
Intel Corporation
0 cites
US125640852026
Microelectronic Assembly with Underfill Flow Control
Intel Corporation
0 cites
US118429442023
IC Assemblies Including Die Perimeter Frames Suitable for Containing Thermal Interface Materials
Intel Corporation
0 cites