Frank Truong

7 Patents

• US118551252023

  Capacitors with Nanoislands on Conductive Plates

  Intel Corporation

  0 cites
• US117372082023

  Microelectronic Assemblies Having Conductive Structures with Different Thicknesses

  Intel Corporation

  0 cites
• US117280772023

  Magnetic Material Having Coated Ferromagnetic Filler Particles

  Intel Corporation

  0 cites
• US117282652023

  Selective Deposition of Embedded Thin-film Resistors for Semiconductor Packaging

  Intel Corporation

  0 cites
• US116886922023

  Embedded Multi-die Interconnect Bridge Having a Substrate with Conductive Pathways and a Molded Material Region with Through-mold Vias

  Intel Corporation

  0 cites
• US115718762023

  Dielectric Film with Pressure Sensitive Microcapsules of Adhesion Promoter

  Intel Corporation

  0 cites
• US115748742023

  Package Architecture Utilizing Photoimageable Dielectric (PID) for Reduced Bump Pitch

  Intel Corporation

  0 cites