Frank Peter Lambrecht

3 Patents

• US126047402026

  Chip Package with Integrated Embedded Off-die Inductors

  XILINX, Inc.

  0 cites
• US119503582024

  Integrated Circuit Package with Voltage Droop Mitigation

  XILINX, Inc.

  0 cites
• US116886752023

  Core Cavity Noise Isolation Structure for Use in Chip Packages

  XILINX, Inc.

  0 cites