22 Patents
- US126157932026Power Semiconductor Device, Method of Producing a Power Semiconductor Device and Method of Operating a Power Semiconductor Device
Infineon Technologies AG
0 cites - 0 cites
- 0 cites
- US124127402025Semiconductor Device with a Porous Portion, Wafer Composite and Method of Manufacturing a Semiconductor Device
Infineon Technologies AG
0 cites - 0 cites
- 0 cites
- US122727382025Methods of Forming Semiconductor Devices in a Layer of Epitaxial Silicon Carbide
Infineon Technologies AG
0 cites - 0 cites
- US122117032025Methods for Forming a Semiconductor Device Having a Second Semiconductor Layer on a First Semiconductor Layer
Infineon Technologies AG
0 cites - 0 cites
- US120339722024Chip Package, Method of Forming a Chip Package and Method of Forming an Electrical Contact
Infineon Technologies AG
0 cites - US119905202024Method of Manufacturing a Semiconductor Device Having Frame Structures Laterally Surrounding Backside Metal Structures
INFINEON TECHNOLOGIES AG
0 cites - US118878942024Methods for Processing a Wide Band Gap Semiconductor Wafer Using a Support Layer and Methods for Forming a Plurality of Thin Wide Band Gap Semiconductor Wafers Using Support Layers
Infineon Technologies AG
0 cites - US118814062024Method of Manufacturing a Semiconductor Device and Semiconductor Wafer
Infineon Technologies AG
0 cites - US118813972024Semiconductor Device with a Porous Portion, Wafer Composite and Method of Manufacturing a Semiconductor Device
Infineon Technologies AG
0 cites - 0 cites
- 0 cites
- 0 cites
- 0 cites
- 0 cites
- 0 cites
- US115762592023Carrier, Laminate and Method of Manufacturing Semiconductor Devices
Infineon Technologies AG
0 cites