Patents/Inventors

Francis J. Carney

Mesa, AZUS33 patents

29 Patents

US126223122026
Multichip Module Supports and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124761322025
Curved Semiconductor Die Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124697092025
Semiconductor Package Electrical Contact Structures and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124446092025
Silicon-on-insulator Die Support Structures and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124313592025
Semiconductor Package Electrical Contacts and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US123745552025
Die Sidewall Coatings and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US123745542025
Semiconductor Packages with Die Including Cavities and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122725722025
Non-planar Semiconductor Packaging Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122551672025
Semiconductor Packages with an Intermetallic Layer
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122305592025
Semiconductor Device and Method of Forming Micro Interconnect Structures
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122305022025
Semiconductor Package Stress Balance Structures and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US121990412025
Thinned Semiconductor Package and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US121702392024
Direct Bonded Copper Substrates Fabricated Using Silver Sintering
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US121320082024
Multidie Supports and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US121320052024
Supports for Thinned Semiconductor Substrates and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US121192942024
Through-substrate via Structure and Method of Manufacture
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US120401922024
Die Sidewall Coatings and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US120209722024
Curved Semiconductor Die Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119086992024
Semiconductor Packages with Die Including Cavities
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119011842024
Backmetal Removal Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US118942452024
Non-planar Semiconductor Packaging Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US118942342024
Semiconductor Packages with Die Support Structure for Thin Die
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US118549952023
Supports for Thinned Semiconductor Substrates and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US118307562023
Temporary Die Support Structures and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US117768702023
Direct Bonded Copper Substrates Fabricated Using Silver Sintering
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US117106912023
Semiconductor Device and Method of Forming Micro Interconnect Structures
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US116462672023
Thinned Semiconductor Package and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US116160082023
Through-substrate via Structure and Method of Manufacture
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US115691402023
Semiconductor Package with Elastic Coupler and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites