11 Patents
- US126207832026Methods for 3d-integrating Photonic Chipsets by Vertical Assembly of Lasers and Passive Components
HRL Laboratories, LLC
0 cites - 0 cites
- US123227142025Heterogeneous Integration of Radio Frequency Transistor Chiplets Having Interconnection Tuning Circuits
Pseudolithic, Inc.
0 cites - US122610912025Chip Integration Into Cavities of a Host Wafer Using Lateral Dielectric Material Bonding
Pseudolithic, Inc.
0 cites - US121912952025Heterogeneous Integration of Radio Frequency Transistor Chiplets Having Interconnections to Host Wafer Circuits for Optimizing Operating Conditions
Pseudolithic, Inc.
0 cites - US121257592024Chip Integration Into Cavities of a Host Wafer Using Lateral Dielectric Material Bonding
Pseudolithic, Inc.
0 cites - US120990922024Built in Self-test of Heterogeneous Integrated Radio Frequency Chiplets
Pseudolithic, Inc.
0 cites - US119404952024Built in Self-test of Heterogeneous Integrated Radio Frequency Chiplets
Pseudolithic, Inc.
0 cites - US118108762023Heterogeneous Integration of Radio Frequency Transistor Chiplets Having Interconnection Tuning Circuits
Pseudolithic, Inc.
0 cites - US117568482023Chip Integration Into Cavities of a Host Wafer Using Lateral Dielectric Material Bonding
Pseudolithic, Inc.
0 cites - US117332972023Built in Self-test of Heterogeneous Integrated Radio Frequency Chiplets
Pseudolithic, Inc.
0 cites