Patents/Inventors

Florian Gstrein

Portland, ORUS30 patents

29 Patents

US125819272026
Contact Over Active Gate Structures with Conductive Trench Contact Taps for Advanced Integrated Circuit Structure Fabrication
Intel Corporation
0 cites
US125060322025
Self-assembled Guided Hole and via Patterning Over Grating
Intel Corporation
0 cites
US124009132025
Contact Over Active Gate Structures with Conductive Trench Contact Taps for Advanced Integrated Circuit Structure Fabrication
Intel Corporation
0 cites
US123811612025
Backside Wafer Treatments to Reduce Distortions and Overlay Errors During Wafer Chucking
Intel Corporation
0 cites
US123410612025
Bottom-up Fill Dielectric Materials for Semiconductor Structure Fabrication and Their Methods of Fabrication
Intel Corporation
0 cites
US123054372025
Hinge Assembly
JULIUS BLUM GmbH
0 cites
US122939132025
Directed Self-assembly Enabled Subtractive Metal Patterning
Intel Corporation
0 cites
US122665272025
Directed Self-assembly Enabled Patterning Over Metal Layers Using Assisting Features
Intel Corporation
0 cites
US122372232025
Contact Over Active Gate Structures Using Directed Self-assembly for Advanced Integrated Circuit Structure Fabrication
Intel Corporation
0 cites
US122305362025
Self-assembled Guided Hole and via Patterning Over Grating
Intel Corporation
0 cites
US122180522025
Advanced Lithography and Self-assembled Devices
Intel Corporation
0 cites
US121762142024
Selective Metal Removal for Conductive Interconnects in Integrated Circuitry
Intel Corporation
0 cites
US120875942024
Colored Gratings in Microelectronic Structures
Intel Corporation
0 cites
US120878362024
Contact Over Active Gate Structures with Metal Oxide-caped Contacts to Inhibit Shorting
Intel Corporation
0 cites
US120806392024
Contact Over Active Gate Structures with Metal Oxide Layers to Inhibit Shorting
Intel Corporation
0 cites
US120365782024
Interconnect Structure Surface Modifications by Passivating Agents
Intel Corporation
0 cites
US120374342024
Chemical Compositions and Methods of Patterning Microelectronic Device Structures
Intel Corporation
0 cites
US120124732024
Directed Self-assembly Structures and Techniques
Intel Corporation
0 cites
US120001892024
Hinge Assembly
JULIUS BLUM GmbH
0 cites
US119880302024
Hinge Assembly
JULIUS BLUM GmbH
0 cites
US119843172024
EUV Patterning Methods, Structures, and Materials
Intel Corporation
0 cites
US119538262024
Lined Photobucket Structure for Back End of Line (BEOL) Interconnect Formation
Intel Corporation
0 cites
US119553432024
Two-stage Bake Photoresist with Releasable Quencher
Intel Corporation
0 cites
US118746002024
Ligand-capped Main Group Nanoparticles as High Absorption Extreme Ultraviolet Lithography Resists
Intel Corporation
0 cites
US118698892024
Self-aligned Gate Endcap (SAGE) Architectures Without Fin End Gap
Intel Corporation
0 cites
US118624632024
Metal Oxide Nanoparticles as Fillable Hardmask Materials
Intel Corporation
0 cites
US118547872023
Advanced Lithography and Self-assembled Devices
Intel Corporation
0 cites
US118376442023
Contact Over Active Gate Structures with Metal Oxide-caped Contacts to Inhibit Shorting
Intel Corporation
0 cites
US116056232023
Materials and Layout Design Options for DSA on Transition Regions Over Active Die
Intel Corporation
0 cites