Florence R. Pon

5 Patents

• US120682832024

  Die Stack with Cascade and Vertical Connections

  Intel Corporation

  0 cites
• US119012742024

  Packaged Integrated Circuit Device with Recess Structure

  Intel Corporation

  0 cites
• US117496532023

  Multi-die, Vertical-wire Package-in-package Apparatus, and Methods of Making Same

  Intel Corporation

  0 cites
• US115629782023

  Decoupling Capacitor Mounted on an Integrated Circuit Die, and Method of Manufacturing the Same

  Intel Corporation

  0 cites
• US115520512023

  Electronic Device Package

  Intel Corporation

  0 cites