Fernando A. Santos

6 Patents

• US124461582025

  Circuit Modules with Encapsulant-embedded Leadframe Terminals, and Methods of Fabricating Such Circuit Modules

  NXP USA, Inc.

  0 cites
• US121842372024

  Surface-mount Amplifier Devices

  NXP USA, Inc.

  0 cites
• US120402912024

  Radio Frequency Packages Containing Multilevel Power Substrates and Associated Fabrication Methods

  NXP USA, Inc.

  0 cites
• US119844292024

  Leadless Power Amplifier Packages Including Topside Termination Interposer Arrangements and Methods for the Fabrication Thereof

  NXP USA, Inc.

  0 cites
• US116212312023

  Methods of Fabricating Leadless Power Amplifier Packages Including Topside Terminations

  NXP USA, Inc.

  0 cites
• US115812412023

  Circuit Modules with Front-side Interposer Terminals and Through-module Thermal Dissipation Structures

  NXP USA, Inc.

  0 cites