Patents/Inventors

Feras Eid

Chandler, AZUS89 patents

74 Patents

US126108172026
Metal Matrix Composite Layers for Heat Dissipation from Integrated Circuit Devices
Intel Corporation
0 cites
US126001592026
Reusable Composite Stencil for Spray Processes
Intel Corporation
0 cites
US126047332026
Package Structures with Collapse Control Features
Intel Corporation
0 cites
US126047542026
Package Structures with Non-uniform Interconnect Features
Intel Corporation
0 cites
US125989892026
Package Structures with Patterned Die Backside Layer
Intel Corporation
0 cites
US125884992026
Integrated Circuit Heat Spreader Including Sealant Interface Material
Intel Corporation
0 cites
US125819382026
Package Architecture for Quasi-monolithic Chip with Backside Power
Intel Corporation
0 cites
US125507682026
Conformal Power Delivery Structures Near High-speed Signal Traces
Intel Corporation
0 cites
US125507812026
Template Structure for Quasi-monolithic Die Architectures
Intel Corporation
0 cites
US125423582026
Microelectronic Devices Designed with Mold Patterning to Create Package-level Components for High Frequency Communication Systems
Intel Corporation
0 cites
US125388412026
Quasi-monolithic Die Architectures
Intel Corporation
0 cites
US125327402026
Porous Mesh Structures for the Thermal Management of Integrated Circuit Devices
Intel Corporation
0 cites
US125327392026
Metal Matrix Composite Layers Having Graded Filler Content for Heat Dissipation from Integrated Circuit Devices
Intel Corporation
0 cites
US124890322025
Cooling of Conformal Power Delivery Structures
Intel Corporation
0 cites
US124827792025
Hybrid Backside Thermal Structures for Enhanced Ic Packages
Intel Corporation
0 cites
US124567022025
Device, Method and System to Mitigate Stress on Hybrid Bonds in a Multi-tier Arrangement of Chiplets
Intel Corporation
0 cites
US124380872025
High Throughput Additive Manufacturing for Integrated Circuit Components Containing Traces with Feature Size and Grain Boundaries
Intel Corporation
0 cites
US124314302025
Technologies for High Throughput Additive Manufacturing for Integrated Circuit Components
Intel Corporation
0 cites
US123811822025
Direct Bonding in Microelectronic Assemblies
Intel Corporation
0 cites
US123746262025
Architectures and Methods of Fabricating 3D Stacked Packages
Intel Corporation
0 cites
US123277752025
Thermal Performance in Hybrid Bonded 3D Die Stacks
Intel Corporation
0 cites
US123005792025
Liquid Cooled Interposer for Integrated Circuit Stack
Intel Corporation
0 cites
US122666822025
Capacitors and Resistors at Direct Bonding Interfaces in Microelectronic Assemblies
Intel Corporation
0 cites
US122610972025
Thermal Management in Integrated Circuit Packages
Intel Corporation
0 cites
US122422902025
Integrating Voltage Regulators and Passive Circuit Elements with Top Side Power Planes in Stacked Die Architectures
Intel Corporation
0 cites
US121990122025
Modular Microchannel Thermal Solutions for Integrated Circuit Devices
Intel Corporation
0 cites
US121990182025
Direct Bonding in Microelectronic Assemblies
Intel Corporation
0 cites
US121702442024
High-throughput Additively Manufactured Power Delivery Vias and Traces
Intel Corporation
0 cites
US121659622024
Hermetic Sealing Structures in Microelectronic Assemblies Having Direct Bonding
Intel Corporation
0 cites
US121551332024
Microelectronic Devices Designed with Mold Patterning to Create Package-level Components for High Frequency Communication Systems
Intel Corporation
0 cites
US121553722024
Multi-filter Die
Intel Corporation
0 cites
US121425102024
Carrier for Microelectronic Assemblies Having Direct Bonding
Intel Corporation
0 cites
US121425432024
Thermal Management Solutions for Embedded Integrated Circuit Devices
Intel Corporation
0 cites
US121365772024
Integrated Circuit Die Packages Including a Contiguous Heat Spreader
Intel Corporation
0 cites
US121192912024
Hermetic Sealing Structures in Microelectronic Assemblies Having Direct Bonding
Intel Corporation
0 cites
US121130482024
Microelectronic Assemblies
Intel Corporation
0 cites
US121070602024
Microelectronic Assemblies with Inductors in Direct Bonding Regions
Intel Corproation
0 cites
US120876822024
Power Delivery Structures
Intel Corporation
0 cites
US120806202024
Additively Manufactured Structures for Heat Dissipation from Integrated Circuit Devices
Intel Corporation
0 cites
US120626312024
Microelectronic Assemblies with Inductors in Direct Bonding Regions
Intel Corporation
0 cites
US120574022024
Direct Bonding in Microelectronic Assemblies
Intel Corporation
0 cites
US120403072024
Magnetic Induced Heating for Solder Interconnects
Intel Corporation
0 cites
US120407762024
Integrated Radio Frequency (RF) Front-end Module (FEM)
Intel Corporation
0 cites
US120339142024
Package with Thermal Interface Material Retaining Structures on Die and Heat Spreader
Intel Corporation
0 cites
US120071702024
Thermal Management in Integrated Circuit Packages
Intel Corporation
0 cites
US120027452024
High Performance Integrated RF Passives Using Dual Lithography Process
Intel Corporation
0 cites
US119904192024
Physically Unclonable Function Circuitry of a Package Substrate and Method of Providing Same
Intel Corporation
0 cites
US119904482024
Direct Bonding in Microelectronic Assemblies
Intel Corporation
0 cites
US119489062024
Hybrid Backside Thermal Structures for Enhanced IC Packages
Intel Corporation
0 cites
US119335552024
Heat Dissipation Device Having Anisotropic Thermally Conductive Sections and Isotropic Thermally Conductive Sections
Intel Corporation
0 cites
US118958152024
Additive Manufacturing for Integrated Circuit Assembly Cables
Intel Corporation
0 cites
US118879442024
Additive Manufacturing for Integrated Circuit Assembly Connectors
Intel Corporation
0 cites
US118549322023
Package Wrap-around Heat Spreader
Intel Corporation
0 cites
US118428262023
Additive Manufacturing for Integrated Circuit Assembly Connector Support Structures
Intel Corporation
0 cites
US118307872023
Thermal Management in Integrated Circuit Packages
Intel Corporation
0 cites
US118239722023
Thermal Management Solutions That Reduce Inductive Coupling Between Stacked Integrated Circuit Devices
Intel Corporation
0 cites
US117915282023
Low Loss and Low Cross Talk Transmission Lines with Stacked Dielectric Layers for Forming Stubs of Different Thickness or for Forming a Coaxial Line
Intel Corporation
0 cites
US117841082023
Thermal Management in Integrated Circuit Packages
Intel Corporation
0 cites
US117841812023
Die Backend Diodes for Electrostatic Discharge (ESD) Protection
Intel Corporation
0 cites
US117768692023
Package with a Highly Conductive Layer Deposited on Die Using Throughput Additive Deposition Prior to TIM1 Dispense
Intel Corporation
0 cites
US117513672023
Microelectronic Package Electrostatic Discharge (ESD) Protection
Intel Corporation
0 cites
US116949622023
Microelectronic Package with Mold-integrated Components
Intel Corporation
0 cites
US116886602023
Bridge for Radio Frequency (RF) Multi-chip Modules
Intel Corporation
0 cites
US116886652023
Thermal Management Solutions for Stacked Integrated Circuit Devices
Intel Corporation
0 cites
US116769182023
Electrostatic Discharge Protection in Integrated Circuits
Intel Corporation
0 cites
US116584182023
Microelectronic Devices Designed with Mold Patterning to Create Package-level Components for High Frequency Communication Systems
Intel Corporation
0 cites
US116520742023
Semiconductor Package with Improved Thermal Blocks
Intel Corporation
0 cites
US116417112023
Microelectronic Package with Substrate-integrated Components
Intel Corporation
0 cites
US116211922023
Inorganic Dies with Organic Interconnect Layers and Related Structures
Intel Corporation
0 cites
US116212082023
Thermal Management Solutions That Reduce Inductive Coupling Between Stacked Integrated Circuit Devices
Intel Corporation
0 cites
US116212362023
Electrostatic Discharge Protection in Integrated Circuits Using Positive Temperature Coefficient Material
Intel Corporation
0 cites
US116159982023
Thermal Management Solutions for Embedded Integrated Circuit Devices
Intel Corporation
0 cites
US116160472023
Microelectronic Assemblies
Intel Corporation
0 cites
US115519942023
Liquid Metal TIM with Stim-like Performance with No BSM and BGA Compatible
Intel Corporation
0 cites