Patents/Inventors

Fengshou Liu

ShanghaiCN2 patents

3 Patents

US123538142025
System-in-package Technology-based Process Design Method and System, Medium, and Device
Vayo (Shanghai) Technology Co., Ltd.
0 cites
US121118112024
EDA Pad Package Library Updating/application Method and System, Medium and Terminal
Vayo (Shanghai) Technology Co. Ltd.
0 cites
US116049162023
Method, System, and Electronic Device for Detecting Open/short Circuit of PCB Design Layout
VAYO (SHANGHAI) TECHNOLOGY CO., Ltd.
0 cites