Fen Yu

5 Patents

• US126223062026

  Semiconductor Device with Optimized Underfill Flow

  SANDISK TECHNOLOGIES, Inc.

  0 cites
• US121548602024

  Method of Forming a Semiconductor Device Including Vertical Contact Fingers

  Sandisk Technologies, Inc.

  0 cites
• US120274972024

  Semiconductor Device with Unbalanced Die Stackup

  Western Digital Technologies, Inc.

  0 cites
• US118108962023

  Substrate Component Layout and Bonding Method for Increased Package Capacity

  Western Digital Technologies, Inc.

  0 cites
• US117841352023

  Semiconductor Device Including Conductive Bumps to Improve EMI/RFI Shielding

  Western Digital Technologies, Inc.

  0 cites