3 Patents
- US124827392025Arrangement for a Semiconductor Arrangement Comprising at Least One Passive Component and a Substrate
Siemens Aktiengesellschaft
0 cites - US121366032024Semiconductor Arrangement Comprising a Semiconductor Element, a Substrate and Bond Connecting Means
Siemens Aktiengesellschaft
0 cites - US118884072024Power Module Having at Least Two Power Semiconductor Arrangements That Are Contacted on a Substrate
Siemens Aktiengesellschaft
0 cites