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Inventors
Felix Deng
Singapore
SG
3 patents
4 Patents
US12048948
2024
Methods for Forming Microwave Tunable Composited Thin-film Dielectric Layer
APPLIED MATERIALS, Inc.
0 cites
US11929260
2024
Low Warpage Curing Methodology by Inducing Curvature
APPLIED MATERIALS, Inc.
0 cites
US11610807
2023
Methods and Apparatus for Cleaving of Semiconductor Substrates
APPLIED MATERIALS, Inc.
0 cites
US11569122
2023
Methods and Apparatus for Cleaving of Semiconductor Substrates
APPLIED MATERIALS, Inc.
0 cites