8 Patents
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- US122889612025Electronic Device Comprising a Transparent Encapsulation Structure Housing an Electronic Chip and Corresponding Production Method
Stmicroelectronics (Grenoble 2) SAS
0 cites - US122781552025Integrated Circuit Package with Heat Sink and Manufacturing Method Thereof
Stmicroelectronics (Grenoble 2) SAS
0 cites - US122729222025Electronic Chip Support Device and Corresponding Manufacturing Method
STMICROELECTRONICS (GRENOBLE 2) SAS
0 cites - US121702622024Method for Forming an Electrical Connection Between an Electronic Chip and a Carrier Substrate and Electronic Device
Stmicroelectronics (Grenoble 2) SAS
0 cites - US119163532024Electronic Chip Support Device and Corresponding Manufacturing Method
STMICROELECTRONICS (GRENOBLE 2) SAS
0 cites - 0 cites
- US115575662023Method for Forming an Electrical Connection Between an Electronic Chip and a Carrier Substrate and Electronic Device
Stmicroelectronics (Grenoble 2) SAS
0 cites