Patents/Inventors

Evelyn Napetschnig

DiexAT5 patents

6 Patents

US121836962024
Semiconductor Device Including Bonding Pad Metal Layer Structure
Infineon Technologies AG
0 cites
US120402882024
Chip Package and Method of Forming a Chip Package
Infineon Technologies AG
0 cites
US117769272023
Semiconductor Device Including a Solder Compound Containing a Compound Sn/sb
Infineon Technologies AG
0 cites
US117641762023
Semiconductor Device Including Bonding Pad Metal Layer Structure
Infineon Technologies AG
0 cites
US117355342023
Chip Package and Method of Forming a Chip Package
Infineon Technologies AG
0 cites
US116159632023
Electronic Device, Electronic Module and Methods for Fabricating the Same
Infineon Technologies AG
0 cites