Patents/Inventors

Eunsuk Jung

Hwaseong-siKR1 patent

2 Patents

US123006712025
Semiconductor Packages and Methods of Manufacturing the Semiconductor Packages
Samsung Electronics Co., Ltd.
0 cites
US118109002023
Semiconductor Packages Stacked by Wafer Bonding Process and Methods of Manufacturing the Semiconductor Packages
Samsung Electronics Co., Ltd.
0 cites