Patents/Inventors

Eunseok Song

Hwaseong-siKR15 patents

14 Patents

US124890832025
3D Laminated Chip, and Semiconductor Package Including the 3D Laminated Chip
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123083632025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US122373082025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122118292025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121660102024
Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120574412024
Semiconductor Package Including a Plurality of Semiconductor Chips
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120403042024
Semiconductor Package and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119963982024
Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119844212024
Integrated Circuit Chip Having BS-PDN Structure
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119013362024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118879652024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US118626182024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US118375772023
System-in-package Module
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116316602023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites