Eunkyoung Choi

5 Patents

• US125388032026

  Semiconductor Package Including a Barrier Structure Covering Connection Pads and Contacting a Protruding Portion of an Adhesive Layer

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US120274712024

  Semiconductor Package Having Stiffener Structure

  Samsung Electronics Co., Ltd.

  0 cites
• US117769182023

  Semiconductor Package Having Stiffening Structure

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US116643462023

  Semiconductor Package Including Semiconductor Chips and Dummy Pad

  Samsung Electronics Co., Ltd.

  0 cites
• US115575432023

  Semiconductor Package

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites