Eung Seok Lee

6 Patents

• US125801272026

  Dielectric Slurry Composition and Multilayer Electronic Component Using Same

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US123810362025

  Manufacturing Method of Capacitor Component

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US122276722025

  Method for Manufacturing a Multilayer Ceramic Capacitor

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US121910812025

  Multilayer Electronic Component

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US120874642024

  Method for Manufacturing Conductive Paste and Method for Manufacturing Multilayer Ceramic Electronic Component

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US118374062023

  Multilayer Electronic Component

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites