12 Patents
- US125327372026Semiconductor Device Package Thermally Coupled to Passive Element
Infineon Technologies AG
0 cites - US123692532025Circuit and Connector Element Alignment, Circuit Board Assemblies
Infineon Technologies Austria AG
0 cites - US123008742025Antenna Package with via Structure and Method of Formation Thereof
Infineon Technologies AG
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- US120149642024Semiconductor Package Having an Electrically Insulating Core with Exposed Glass Fibres
Infineon Technologies Americas Corp.
0 cites - US119730632024Semiconductor Package with Low Parasitic Connection to Passive Device
Infineon Technologies AG
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- US118176172023Antenna Package with via Structure and Method of Formation Thereof
Infineon Technologies AG
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