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Eun Hye Do
Icheon-si Gyeonggi-do
KR
7 patents
3 Patents
US12622253
2026
Semiconductor Device with Through Vias of Various Shapes and Method of Manufacturing the Same
SK Hynix Inc.
0 cites
US11996392
2024
Semiconductor Package Including Stacked Semiconductor Chips
SK Hynix Inc.
0 cites
US11664351
2023
Semiconductor Package Including Stacked Semiconductor Chips
SK Hynix Inc.
0 cites