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Inventors
Erik R. Byers
Boise, ID
US
2 patents
3 Patents
US12160993
2024
Memory Devices Including Different Tier Pitches, and Related Electronic Systems
0 cites
US11805645
2023
Integrated Assemblies Having Rugged Material Fill, and Methods of Forming Integrated Assemblies
Micron Technology, Inc.
0 cites
US11751396
2023
Microelectronic Devices Including Varying Tier Pitch, and Related Electronic Systems
0 cites