Patents/Inventors

Erik Nino Mercado Tolentino

SerembanMY3 patents

4 Patents

US121702392024
Direct Bonded Copper Substrates Fabricated Using Silver Sintering
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US121600602024
Bonding Module Pins to an Electronic Substrate
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US117768702023
Direct Bonded Copper Substrates Fabricated Using Silver Sintering
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US116266772023
Bonding Module Pins to an Electronic Substrate
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites