6 Patents
- 0 cites
- US123116612025Integrated Circuits Including High-voltage High-power and High-voltage Low-power Supply Nodes
Hewlett-packard Development Company, L.P.
0 cites - US122336452025Fluidic Die Having Trickle-warming and Pulse-warming Circuits
Hewlett-packard Development Company, L.P.
0 cites - US119517392024Fluidic Die with High Aspect Ratio Power Bond Pads
Hewlett-packard Development Company, L.P.
0 cites - US118582692024Cavitation Plate to Protect a Heating Component and Detect a Condition
Hewlett-packard Development Company, L.P.
0 cites - 0 cites