Patents/Inventors

Eric J. Li

Chandler, AZUS2 patents

3 Patents

US119554342024
Ultra Small Molded Module Integrated with Die by Module-on-wafer Assembly
Intel Corporation
0 cites
US117053772023
Stacked Die Cavity Package
Intel Corporation
0 cites
US116769002023
Electronic Assembly That Includes a Bridge
Intel Corporation
0 cites