3 Patents
- US124043862025Cured Epoxy Resin Composition Suitable for Electronic Device Enclosure, Articles, and Methods
3M Innovative Properties Company
0 cites - US118848502024Adhesive Film Including a (meth)acrylate Matrix Including a Curable Epoxy/thiol Resin Composition, Tape, and Method
3M INNOVATIVE PROPERTIES COMPANY
0 cites - US117732542023Cured Epoxy Resin Composition Suitable for Electronic Device Enclosure, Articles, and Methods
3M Innovative Properties Company
0 cites