Eric Beyne

5 Patents

• US125576342026

  Integrated Circuit Chip Including Back Side Power Delivery Tracks

  IMEC VZW

  0 cites
• US123622362025

  Method of Producing an Integrated Circuit Chip Including a Back-side Power Delivery Network

  IMEC VZW

  0 cites
• US123425032025

  Device and System for Cooling an Electronic Component

  IMEC Vzw

  0 cites
• US118108922023

  Method of Direct Bonding Semiconductor Components

  IMEC Vzw

  0 cites
• US117697502023

  Substrate, Assembly and Method for Wafer-to-wafer Hybrid Bonding

  Imec VZW

  0 cites