24 Patents
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- US122665952025Semiconductor Device Package with Isolated Semiconductor Die and Electric Field Curtailment
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- US121836932024Integrated Magnetic Assembly with Conductive Field Plates
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0 cites - US121701642024Integrated High Voltage Electronic Device with High Relative Permittivity Layers
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- US118797902024Isolated Temperature Sensor Package with Embedded Spacer in Dielectric Opening
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0 cites - US118814452024High Voltage Semiconductor Device Lead Frame and Method of Fabrication
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0 cites - US118814612024Electric Field Control for Bond Pads in Semiconductor Device Package
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- US117282892023Integrated Magnetic Assembly with Conductive Field Plates
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- US116212152023Semiconductor Device Package with Isolated Semiconductor Die and Electric Field Curtailment
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0 cites - US116144822023Method for Manufacturing Semiconductor Device Package with Isolation
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0 cites - US115987422023Semiconductor Device for Sensing Impedance Changes in a Medium
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- US115691532023Leadframes with Folded Conductor Portion and Devices Therefrom
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0 cites - US115693962023Optical Sensor Package with Optically Transparent Mold Compound
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