5 Patents
- US124630752025Cathode Assembly for Integration of Embedded Electrostatic Chuck (ESC)
Applied Materials, Inc.
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- US117215832023Mainframe-less Wafer Transfer Platform with Linear Transfer System for Wafer Processing Modules
Applied Materials, Inc.
0 cites - US116004922023Electrostatic Chuck with Reduced Current Leakage for Hybrid Laser Scribing and Plasma Etch Wafer Singulation Process
Applied Materials, Inc.
0 cites