Patents/Inventors

Eng Huat Goh

Ayer ItamMY27 patents

21 Patents

US126047362026
Shield to Reduce Substrate Electromagnetic Interference and Warpage
Intel Corporation
0 cites
US126047622026
Methods and Apparatus to Reduce Thickness of On-package Memory Architectures
Intel Corporation
0 cites
US125819722026
Electrically Conductive Strips on a Side of a Memory Module
Intel Corporation
0 cites
US125754482026
Integrated Circuit Packages with on Package Memory Architectures
Intel Corporation
0 cites
US125001552025
Electronic Package with Passive Component Between Substrates
Intel Corporation
0 cites
US124009522025
Stripped Redistrubution-layer Fabrication for Package-top Embedded Multi-die Interconnect Bridge
Intel Corporation
0 cites
US123492762025
Co-planar Interconnection Mechanisms for Circuit Boards
Intel Corporation
0 cites
US123411212025
Through-substrate Underfill Formation for an Integrated Circuit Assembly
Intel Corporation
0 cites
US120027932024
Integrating System in Package (sip) with Input/output (IO) Board for Platform Miniaturization
Intel Corporation
0 cites
US119292952024
Multi-use Package Architecture
Intel Corporation
0 cites
US119087932024
Stripped Redistrubution-layer Fabrication for Package-top Embedded Multi-die Interconnect Bridge
Intel Corporation
0 cites
US118239942023
Systems and Apparatuses for Implementing a Pad on Solder Mask (POSM) Semiconductor Substrate Package
Intel Corporation
0 cites
US116996442023
Organic Mold Interconnects in Shielded Interconnects Frames for Integrated-circuit Packages
Intel Corporation
0 cites
US116996642023
Wrappable EMI Shields
Intel Corporation
0 cites
US116643172023
Reverse-bridge Multi-die Interconnect for Integrated-circuit Packages
Intel Corporation
0 cites
US116581112023
Stripped Redistrubution-layer Fabrication for Package-top Embedded Multi-die Interconnect Bridge
Intel Corporation
0 cites
US116581272023
RFI Free Picture Frame Metal Stiffener
Intel Corporation
0 cites
US116520572023
Disaggregated Die Interconnection with On-silicon Cavity Bridge
Intel Corporation
0 cites
US115878442023
Electronic Device Package on Package (POP)
Intel Corporation
0 cites
US115894602023
System in Package Dual Connector
INTEL CORPORATION
0 cites
US115524032023
Slot Antenna on a Printed Circuit Board (PCB)
Intel Corporation
0 cites