Elley Zhang

3 Patents

• US124827612025

  Semiconductor Device Package Having Improved Conductive Stub Coverage

  SANDISK TECHNOLOGIES, Inc.

  0 cites
• US123411302025

  Method of Thinning a Semiconductor Die

  Western Digital Technologies, Inc.

  0 cites
• US119424592024

  Semiconductor Device Package with Exposed Bond Wires

  Western Digital Technologies, Inc.

  0 cites