Elijah Karpov

7 Patents

• US126222582026

  Self-aligned Staggered Integrated Circuit Interconnect Features

  Intel Corporation

  0 cites
• US125001622025

  Staggered Vertically Spaced Integrated Circuit Line Metallization with Differential Vias and Metal-selective Deposition

  Intel Corporation

  0 cites
• US124827442025

  Subtractively Patterned Interconnect Structures for Integrated Circuits

  Intel Corporation

  0 cites
• US123410922025

  Planar Slab Vias for Integrated Circuit Interconnects

  Intel Corporation

  0 cites
• US120274582024

  Subtractively Patterned Interconnect Structures for Integrated Circuits

  Intel Corporation

  0 cites
• US119859092024

  Fabrication of Stackable Embedded Edram Using a Binary Alloy Based on Antimony

  Intel Corporation

  0 cites
• US116597222023

  Thin-film-transistor Based Complementary Metal-oxide-semiconductor (CMOS) Circuit

  Intel Corporation

  0 cites