Elah Bozorg-grayeli

10 Patents

• US122835352025

  IC Die and Heat Spreaders with Solderable Thermal Interface Structures for Multi-chip Assemblies Including Solder Array Thermal Interconnects

  Intel Corporation

  0 cites
• US119843772024

  IC Die and Heat Spreaders with Solderable Thermal Interface Structures for Assemblies Including Solder Array Thermal Interconnects

  Intel Corporation

  0 cites
• US119357992024

  Integrated Circuit Package Lids with Polymer Features

  Intel Corporation

  0 cites
• US119358082024

  IC Die and Heat Spreaders with Solderable Thermal Interface Structures for Multi-chip Assemblies Including Solder Array Thermal Interconnects

  Intel Corporation

  0 cites
• US119232672024

  IC Die with Solderable Thermal Interface Structures for Assemblies Including Solder Array Thermal Interconnects

  Intel Corporation

  0 cites
• US118814382024

  First-level Integration of Second-level Thermal Interface Material for Integrated Circuit Assemblies

  Intel Corporation

  0 cites
• US118814402024

  Carbon Based Polymer Thermal Interface Materials with Polymer Chain to Carbon Based Fill Particle Bonds

  Intel Corporation

  0 cites
• US118698242024

  Thermal Interface Structures for Integrated Circuit Packages

  Intel Corporation

  0 cites
• US117106722023

  Microelectronic Package with Underfilled Sealant

  Intel Corporation

  0 cites
• US117106772023

  Ultraviolet (uv)-curable Sealant in a Microelectronic Package

  Intel Corporation

  0 cites