Patents/Inventors

Ela Mia Cadag

CalambaPH5 patents

6 Patents

US122550762025
Method for Manufacturing Leadless Semiconductor Package with Wettable Flanks
STMICROELECTRONICS, Inc.
0 cites
US122117742025
Lead Stabilization in Semiconductor Packages
STMICROELECTRONICS, Inc.
0 cites
US119292592024
Method for Manufacturing Leadless Semiconductor Package with Wettable Flanks
STMICROELECTRONICS, Inc.
0 cites
US119160902024
Tapeless Leadframe Package with Exposed Integrated Circuit Die
Stmicroelectronics, Inc.
0 cites
US115575482023
Package with Interlocking Leads and Manufacturing the Same
Stmicroelectronics, Inc.
0 cites
US115520072023
Modified Leadframe Design with Adhesive Overflow Recesses
Stmicroelectronics, Inc.
0 cites