Patents/Inventors

Eiji Kurose

Oizumi-machiJP14 patents

14 Patents

US124697092025
Semiconductor Package Electrical Contact Structures and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124446092025
Silicon-on-insulator Die Support Structures and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124313592025
Semiconductor Package Electrical Contacts and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US123745542025
Semiconductor Packages with Die Including Cavities and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US123745552025
Die Sidewall Coatings and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US123410142025
Multi-faced Molded Semiconductor Package and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122305022025
Semiconductor Package Stress Balance Structures and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US120401922024
Die Sidewall Coatings and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US120403102024
Methods of Forming Semiconductor Packages with Back Side Metal
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119086992024
Semiconductor Packages with Die Including Cavities
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119011842024
Backmetal Removal Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US118942342024
Semiconductor Packages with Die Support Structure for Thin Die
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US117912972023
Molded Semiconductor Package and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US115629812023
Methods of Forming Semiconductor Packages with Back Side Metal
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites