Eiichi Nomura

3 Patents

• US123623102025

  Multi-layer Sheet for Mold Underfill Encapsulation, Method for Mold Underfill Encapsulation, Electronic Component Mounting Substrate, and Production Method for Electronic Component

  NAGASE CHEMTEX CORPORATION

  0 cites
• US117187702023

  Curable Resin Composition and Curable Sheet

  NAGASE CHEMTEX CORPORATION

  0 cites
• US117106452023

  Manufacturing Method of Mounting Structure, and Sheet Therefor

  NAGASE CHEMTEX CORPORATION

  0 cites