17 Patents
- US125936922026Thermal Management of GPU-HBM Package by Microchannel Integrated Substrate
Micron Technology, Inc.
0 cites - US125640672026Wafer Alignment for Stacked Wafers and Semiconductor Device Assemblies
Micron Technology, Inc.
0 cites - 0 cites
- US124245742025Polymer Coated Semiconductor Devices and Hybrid Bonding to Form Semiconductor Assemblies
Micron Technology, Inc.
0 cites - US123623112025Anisotropic Conductive Film with Carbon-based Conductive Regions Having Void Space and Related Semiconductor Device Assemblies and Methods
Micron Technology, Inc.
0 cites - US122782022025Modular Construction of Hybrid-bonded Semiconductor Die Assemblies and Related Systems and Methods
Micron Technology, Inc.
0 cites - 0 cites
- US122372992025Systems and Methods for Direct Bonding in Semiconductor Die Manufacturing
Micron Technology, Inc.
0 cites - US121990682025Methods of Forming Microelectronic Device Assemblies and Packages
Micron Technology, Inc.
0 cites - 0 cites
- US119159972024Thermal Management of GPU-HBM Package by Microchannel Integrated Substrate
Micron Technology, Inc.
0 cites - US118814682024Anisotropic Conductive Film with Carbon-based Conductive Regions and Related Semiconductor Device Assemblies and Methods
Micron Technology, Inc.
0 cites - US118174202023Systems and Methods for Direct Bonding in Semiconductor Die Manufacturing
Micron Technology, Inc.
0 cites - US117913152023Semiconductor Assemblies Including Thermal Circuits and Methods of Manufacturing the Same
Micron Technology, Inc.
0 cites - 0 cites