22 Patents
- US124631162025Method for Fabricating a Semiconductor Device Including an Embedded Semiconductor Die
Infineon Technologies Austria AG
0 cites - US124380632025Electronic Module Including a Semiconductor Package Disposed on an Interposer Layer
Infineon Technologies Austria AG
0 cites - 0 cites
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- US122372422025Semiconductor Device Package Comprising a Thermal Interface Material with Improved Handling Properties
Infineon Technologies Austria AG
0 cites - US122180292025Semiconductor Device with Improved Performance in Operation and Improved Flexibility in the Arrangement of Power Chips
Infineon Technologies Austria AG
0 cites - US122180302025Electronic Module Comprising a Semiconductor Package with Integrated Clip and Fastening Element
Infineon Technologies Austria AG
0 cites - US121366232024Multi-device Semiconductor Chip with Electrical Access to Devices at Either Side
Infineon Technologies Austria AG
0 cites - US121257722024Method of Forming a Semiconductor Package with Connection Lug
Infineon Technologies Austria AG
0 cites - US120947932024Package with Electrically Insulated Carrier and at Least One Step on Encapsulant
Infineon Technologies AG
0 cites - US120806692024Semiconductor Device Module Having Vertical Metallic Contacts and a Method for Fabricating the Same
Infineon Technologies Austria AG
0 cites - US120027392024Semiconductor Device Including an Embedded Semiconductor Die
Infineon Technologies Austria AG
0 cites - US119843922024Semiconductor Package Having a Chip Carrier with a Pad Offset Feature
Infineon Technologies AG
0 cites - US119554072024Electronic Module Including a Semiconductor Package Connected to a Fluid Heatsink
Infineon Technologies Austria AG
0 cites - 0 cites
- US119292982024Molded Semiconductor Package with Dual Integrated Heat Spreaders
Infineon Technologies AG
0 cites - US118760282024Package with Electrically Insulated Carrier and at Least One Step on Encapsulant
Infineon Technologies AG
0 cites - 0 cites
- US117216162023Semiconductor Package with Signal Distribution Element
Infineon Technologies Austria AG
0 cites - US117157192023Semiconductor Package and Method of Forming a Semiconductor Package
Infineon Technologies AG
0 cites - US116887132023Additive Manufacturing of a Frontside or Backside Interconnect of a Semiconductor Die
Infineon Technologies Austria AG
0 cites - US116462582023Electronic Devices Including Electrically Insulated Load Electrodes
Infineon Technologies AG
0 cites