Patents/Inventors

Edvin Cetegen

Chandler, AZUS24 patents

23 Patents

US123622502025
Protruding SN Substrate Features for Epoxy Flow Control
Intel Corporation
0 cites
US123344532025
Soldered Metallic Reservoirs for Enhanced Transient and Steady-state Thermal Performance
Intel Corporation
0 cites
US122611502025
Mold Shelf Package Design and Process Flow for Advanced Package Architectures
Intel Corporation
0 cites
US121762682024
Open Cavity Bridge Co-planar Placement Architectures and Processes
Intel Corporation
0 cites
US120877312024
No Mold Shelf Package Design and Process Flow for Advanced Package Architectures
Intel Corporation
0 cites
US120682222024
Dummy Die Structures of a Packaged Integrated Circuit Device
Intel Corporation
0 cites
US120092712024
Protruding SN Substrate Features for Epoxy Flow Control
Intel Corporation
0 cites
US120027272024
Barrier Structures for Underfill Containment
Intel Corporation
0 cites
US119423932024
Substrate with Thermal Insulation
Intel Corporation
0 cites
US119358612024
Underfill Flow Management in Electronic Assemblies
Intel Coropration
0 cites
US119013332024
No Mold Shelf Package Design and Process Flow for Advanced Package Architectures
Intel Corporation
0 cites
US118879622024
Microelectronic Structures Including Bridges
Intel Corporation
0 cites
US118549452023
Underfill Material Flow Control for Reduced Die-to-die Spacing in Semiconductor Packages
Tahoe Research, Ltd.
0 cites
US118324192023
Full Package Vapor Chamber with IHS
Intel Corporation
0 cites
US117912742023
Multichip Semiconductor Package Including a Bridge Die Disposed in a Cavity Having Non-planar Interconnects
Intel Corporation
0 cites
US117768212023
Micro-electronic Package with Substrate Protrusion to Facilitate Dispense of Underfill Between a Narrow Die-to-die Gap
Intel Corporation
0 cites
US117768642023
Corner Guard for Improved Electroplated First Level Interconnect Bump Height Range
Intel Corporation
0 cites
US117697532023
Thermally-optimized Tunable Stack in Cavity Package-on-package
Intel Corporation
0 cites
US117354952023
Active Package Cooling Structures Using Molded Substrate Packaging Technology
Intel Corporation
0 cites
US116462742023
Multi-package Assemblies Having Foam Structures for Warpage Control
Intel Corporation
0 cites
US115748512023
Coupled Cooling Fins in Ultra-small Systems
Intel Corporation
0 cites
US115519942023
Liquid Metal TIM with Stim-like Performance with No BSM and BGA Compatible
Intel Corporation
0 cites
US115454072023
Thermal Management Solutions for Integrated Circuit Packages
Intel Corporation
0 cites