5 Patents
- US126160392026Electronic System Having Intermetallic Connection Structure with Central Intermetallic Mesh Structure and Mesh-free Exterior Structures
Infineon Technologies AG
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- US121365782024Interlayer of Sub-structure Having Elevations and Further Sub-structure with Filler Particles in Recesses Between the Elevations
Infineon Technologies AG
0 cites - US116520122023Inorganic Encapsulant for Electronic Component with Adhesion Promoter
Infineon Technologies AG
0 cites