5 Patents
- US124890582025Wiring Material for Semiconductor Device, Wiring for Semiconductor Device Including the Same, and Semiconductor Device Including the Wiring
Samsung Electronics Co., Ltd.
0 cites - US120149852024Semiconductor Interconnect, Electrode for Semiconductor Device, and Method of Preparing Multielement Compound Thin Film
AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
0 cites - US118308142023Wiring Material for Semiconductor Device, Wiring for Semiconductor Device Including the Same, and Semiconductor Device Including the Wiring
Samsung Electronics Co., Ltd.
0 cites - US117282702023Semiconductor Interconnect, Electrode for Semiconductor Device, and Method of Preparing Multielement Compound Thin Film
AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
0 cites - US116347932023Quasicrystalline Material and Semiconductor Device Applying the Same
Industry-academic Cooperation Foundation, Yonsei University
0 cites