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4 Patents

• US125124012025

  Integrated Device Substrate Including Embedded Electromagnetic Isolation Structure

  QUALCOMM INCORPORATED

  0 cites
• US122438552025

  Package Comprising Channel Interconnects Located Between Solder Interconnects

  QUALCOMM INCORPORATED

  0 cites
• US120626482024

  Multiple (multi-) Die Integrated Circuit (IC) Packages for Supporting Higher Connection Density, and Related Fabrication Methods

  QUALCOMM INCORPORATED

  0 cites
• US118174062023

  Semiconductor Die Employing Repurposed Seed Layer for Forming Additional Signal Paths to Back End-of-line (BEOL) Structure, and Related Integrated Circuit (IC) Packages and Fabrication Methods

  QUALCOMM INCORPORATED

  0 cites