86 Patents
- US126220822026Stacked CMOS Image Sensor with Sti-free Photodetector Isolation and Method for Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US126158572026Semiconductor Imaging Device Having Improved Dark Current Performance
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US125989852026Semiconductor Structure and Forming Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US125817642026Bond Structure Having Shielding Structures for Stacked IC Chips
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US125574052026Structure and Method for Backside-illuminated Image Device
TAIWAN SEMICONDUCTOR MANUFACUTURING COMPANY, Ltd
0 cites - 0 cites
- US125325602026Isolation Structure with Multiple Components to Increase Image Sensor Performance
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US125074902025Semiconductor Device Including Germanium Region Disposed in Semiconductor Substrate
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US124905372025Image Sensor Having an Improved Structure for Small Pixel Designs
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US124905382025Stacked Structure for CMOS Image Sensors
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US124827912025Stacked Integrated Circuits with Redistribution Lines
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US1247622420253DIC Interconnect Apparatus and Method
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US124397062025Device Over Photodetector Pixel Sensor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US124246052025Hybrid Bonding with Uniform Pattern Density
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US1239628320253DIC Seal Ring Structure and Methods of Forming Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123811952025Semiconductor Devices and Methods of Manufacture Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123827442025Stacked Substrate Structure with Inter-tier Interconnection
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123226942025Metal-insulator-metal Device with Improved Performance
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123158432025Hybrid Bonding Technology for Stacking Integrated Circuits
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US122835642025Semiconductor Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122782502025Semiconductor Device Including Image Sensor and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122552192025Image Sensor with Overlap of Backside Trench Isolation Structure and Vertical Transfer Gate
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122305542025Shield Structure for Backside Through Substrate Vias (tsvs)
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US122181652025Semiconductor Image Sensor and Method of Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US122181662025CSI with Controllable Isolation Structure and Methods of Manufacturing and Using the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122181642025Semiconductor Image-sensing Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US122181062025Backside Contact to Improve Thermal Dissipation Away from Semiconductor Devices
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122118762025Extra Doped Region for Back-side Deep Trench Isolation
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122058682025Oversized via as Through-substrate-via (TSV) Stop Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121913362025Image Sensor Having a Gate Dielectric Structure for Improved Device Scaling
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121763702024Stacked Structure for CMOS Image Sensors Including Through-substrate-via Contacting Negative Bias Circuit
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121549392024High Capacitance MIM Device with Self Aligned Spacer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- 0 cites
- US121487822024Composite BSI Structure and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121425692024Integrated Chip for Standard Logic Performance Improvement Having a Back-side Through-substrate-via and Method for Forming the Integrated Chip
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120682872024Stacked Semiconductor Structure and Method
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- 0 cites
- US120403362024Semiconductor Imaging Device Having Improved Dark Current Performance
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120339192024Backside or Frontside Through Substrate via (TSV) Landing on Metal
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US120092142024Gate Electrodes with Notches and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119964332024Pad Structure for Front Side Illuminated Image Sensor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119963992024Hybrid Bonding with Uniform Pattern Density
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119844652024Multiple Deep Trench Isolation (MDTI) Structure for CMOS Image Sensor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119787582024Methods and Apparatus for via Last Through-vias
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119731012024Mechanisms for Forming Image-sensor Device with Deep-trench Isolation Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119554282024Semiconductor Structure and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US119423682024Through Silicon Vias and Methods of Fabricating Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119233382024Stacked Integrated Circuits with Redistribution Lines
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US119159772024Interconnect Structure for Stacked Device
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119088782024Image Sensor and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119013962024Back Side Illuminated Image Sensor with Reduced Sidewall-induced Leakage
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119013882024Device Over Photodetector Pixel Sensor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US118944102024Bond Pad Structure for Bonding Improvement
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US118549592023Metal-insulator-metal Device with Improved Performance
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US118375952023Semiconductor Device Structure and Method for Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US118174702023Stacked Substrate Structure with Inter-tier Interconnection
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US1179891620233DIC Interconnect Apparatus and Method
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US117913612023Image Sensor with Overlap of Backside Trench Isolation Structure and Vertical Transfer Gate
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117913572023Composite BSI Structure and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US117697912023High Capacitance MIM Device with Self Aligned Spacer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117641292023Method of Forming Shield Structure for Backside Through Substrate Vias (TSVS)
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117569362023Backside Contact to Improve Thermal Dissipation Away from Semiconductor Devices
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117569722023Apparatus for Reducing Optical Cross-talk in Image Sensors
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US117568622023Oversized via as Through-substrate-via (TSV) Stop Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117569202023Semiconductor Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117283662023Extra Doped Region for Back-side Deep Trench Isolation
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117054742023Metal Reflector Grounding for Noise Reduction in Light Detector
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117054492023Through Silicon via Design for Stacking Integrated Circuits
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US116463082023Through Silicon via Design for Stacking Integrated Circuits
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US115968002023Interconnect Structure and Method of Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US116006532023Methods and Apparatus for via Last Through-vias
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US115879102023Stacked Semiconductor Structure and Method
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US115520272023Semiconductor Packaging Device Comprising a Shield Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites